Name: Defying the Footprint: How to Increase Flow Without Design Changes | Presented by CPC
Uploaded: 2026-07-15T15:46:12.505Z
Duration: 1 h 15 min 28 s
Description: Defying the Footprint: How to Increase Flow Without Design Changes | Presented by CPC

Transcript for "Defying the Footprint: How to Increase Flow Without Design Changes | Presented by CPC": Hello, everyone, and welcome to day one of data center cooling days, a special event from ThermoLive. I'm Curtis Honeycutt, and I'll be your host today. And, Cap, starting off the day with a historical detour. Are you up for it? So every so often, we reach an inflection point when a technological innovation completely changes the world around us. And I know. I know. That sounds like a big sweeping statement, and that's because it is, but it's true. So instead of talking about a big technological innovation, I'm gonna investigate for a few minutes how groundbreaking technologies and inventions have always required physical networks to underpin them. The support systems that provided the scaffolding for the innovations to thrive outside just a single laboratory. So now for a visit back to history class. I promise it'll be quick, and I'm gonna gloss over a lot. Believe me. So if you'll recall back in the nineteenth century, the steam engine was the big catalyst for the industrial revolution, and it paved the way in The US for a massive railroad system that stretched across across the entire country, you know, from sea to shining sea. However, for an entire country to benefit from railroads, governments and private companies had to construct a massive interconnected network of physical infrastructure. A single locomotive was a remarkable A single locomotive was a remarkable invention, and it was made possible by the steam engine. Right? But that wasn't enough to transform an entire country. Thousands of miles of track had to be laid, bridges had to be built, stations constructed, supply chains established, and so on. Sure. We needed the steam engine to kick start it, but the railroad was truly made possible through infrastructure. Fast forward a few years and here comes the telephone, another great invention. This allowed people to hear each other's voices over long distances. Phenomenal. Right? Well, it's great as long as you have something in place to connect the lines. And this is more than just two tin cans connected by a piece of string. In order to create a network of interconnected telephones, it took the same type of massive physical deployment as laying rail tracks did. Around the same time, Thomas Edison's incandescent bulb was a revolutionary invention, but it wasn't beneficial to everyone until a system existed to generate and deliver electricity to individual homes, a physical system. It needed interconnected wires, conduits, utility poles, and a centralized hub so the entire community no longer had to rely on candlelight. What a great idea. I mean, the light bulb is literally the emoji that translates roughly into great idea. I mean, when an invention lives on as a modern twenty first century hieroglyph, and I'm talking about the emoji keyboard on our phones, you'd know you've made a lasting impact on civilization. And the benefits of these types of technological breakthroughs, the railroad, the light bulb, have always been supported by physical networks. Consumer Internet, which gave us instant access to information, is a perfect twentieth century example. Some of you may remember sitting in front of a Gateway 2,000 computer in the mid nineteen nineties. Right? For me, it was middle school. You're listening as your modem dialed into AOL. You can hear that nineties memory. Right? That strange series of beeps and hisses and screeches, I'm not gonna make the noise, wasn't just computer noise. Just like telephones allowed people to hear each other's voices, that AOL dial up sound was your computer's modem taking digital zeros and ones and translating them into sound, then transmitting them over physical copper telephone wires to another computer somewhere else. The moment my family's home computer was connected to this exciting physical global network, its utility multiplied exponentially. The Internet has always been physical, a tangible thing that requires sophisticated infrastructure. It's never been up in a cloud. Right? This is where we're gonna hit the fast forward button again because I know quite a bit happened between AOL and AI, but here we have arrived at another great inflection point, artificial intelligence, which empowers us to automate complex thought and synthesize massive data instantly. Often, we talk about AI as if it were an ethereal disembodied mind floating in the digital cloud. But just like the steam engine or the dial up modem, AI too is bound by the laws of physics, and even AI can't exist without a physical home. Modern data centers, these big structures are built and engineered to handle the unprecedented computational demands of AI. The defining engineering challenges of the AI era aren't simply about building more capable AI models, which are also advancing at breakneck speed. But the real hurdle is building infrastructure powerful enough and efficient enough to support the demand for AI data transfer. And that's exactly why we're here today. In a talk he gave last year, NVIDIA CEO Jensen Huang said AI is now infrastructure, and this infrastructure, just like the Internet, just like electricity, needs factories. These factories are data centers. We know this. And we also know that factories produce heat. So how do we power and cool this physical network infrastructure to support the continued surging demand for AI computing? Without data center cooling, this exciting powerful AI technology simply isn't accessible. That's why this conversation has become so important. And what's amazing is that all of us are here with the same goal, tackling the challenge of data center cooling. This isn't history as you guys know. It's news. As recently as yesterday, the challenges facing data centers are front page headlines. And judging by the incredible response to this data center cooling days event, it's clear that not just data center folks are recognizing the significance of what's happening. We've seen one of the strongest registration responses we've had for any of our Thermolive events, and we're bringing together engineers and designers and researchers and leaders from several industries together. So today's, sessions, we're gonna hear from experts approaching from, approaching the thermal challenges of data centers from different angles, from liquid and immersion cooling to thermal innovations and new approaches still taking shape. And this is just day one. Day two of data center cooling days is next Wednesday, July 22, one week from today. And since you registered for day one today, you're also registered for next week's sessions day two. You can attend those sessions live. We're on demand, but we hope you'll join us live. In my opinion, day two includes some truly can't miss sessions, and we're actually gonna announce a few new speakers we have lined up for that later today. And you'll hear it here first. As a thank you for attending today, you'll receive exclusive early access to a great resource created by Electronics Cooling. It's the 2026 data center cooling product guide. And in a second, we'll put that as that link is a banner down here as well as in the chat. And we're gonna give this to you guys before we release it publicly. This, 2026 data center cooling new product guide is a practical reference for evaluating the latest products and technologies supporting high density cooling across the chip, the rack, and facility. In it, you'll find new products with vendor details and key specifications, including cooling hardware, monitoring and controls, airflow and heat exchangers, thermal materials, test tools, and some additional insights that we've written about data center cooling developments. So you can download your free twenty twenty six data center cooling new product guide now. You can see that link right there, and it's also in the chat. And because of the incredible response to this data center cooling day series, we're already planning data center cooling day three later this year. We'll have more ideas to explore from industry leaders, and we hope you'll join us there. Finally, before we get before we begin, I'd like to extend a special thank you to our master sponsor today, Anton Parr. Anton Parr helps the data center cooling industry by providing high end precision analytical instruments that help monitor and optimize cooling fluids so this infrastructure we've been talking about can continue operating at peak performance. Thanks again for being here for day one of data center cooling days. Let's get started. We really do want you to be part of the discussion and use the chat area today within our event platform. So go ahead and give it a try by letting us know where in the world you're joining us from today. In today's first session, we will explore how to optimize flow coefficient and overcome space constraints within the data center to enable the higher flow levels needed for cutting edge AI applications. We'll hear insights from the lab and the field, providing key considerations and actionable takeaways for liquid cooling design from the facility to the server blade. Our presenter is Dylan Ozicki, who's part of the applications engineering team at Colder Products Company or CPC, where he supports technical customers in specifying connectors for liquid cooling systems. CPC is a premier global manufacturer of quick disconnect couplings, fittings, and connectors for flexible tubing, and they're widely regarded as an industry standard for fluid management, particularly for liquid cooling applications in data centers. So we're gonna hear from Dylan in a moment, and he really wanted to be with us live today. However, he got called for jury duty this week, so he is off performing his civic duty. If you do have questions for him related to his presentation, please type them in the q and a tab to the right of the chat tab, and we'll make sure he gets those questions afterwards and follows up with you. Now let's hear from Dylan on how to increase flow without design changes. Alright. Hello, everyone. Thank you for joining. Alright. Hello, everyone. Thank you for joining. This is data center days through the thermal life twenty twenty six. We're going to be talking today about defining the footprint, and we're going to start out with in the rec. What does that mean? We'll get into that in just a minute. Real quick introduction. My name is Dylan Ozicki and I'm an applications engineer in in the thermal management group at Colder Products Company, CPC. Hopefully, some of you have heard of us. I've got a pretty broad background. I have degrees in physics and aerospace engineering. I've worked in a variety of industries from air data sensors, medical device manufacturing, industrial components, and, even software for a little bit. But now the best part of my job is getting to work with all of you, the people out in the field making these incredible systems, working on thermal management of these data centers and HPC systems. And what we do is work together to figure out what is the best solution for your application. We go through things like material considerations and performance specifications and ultimately figuring out how do we move forward together? How do we come up with the best solution for what you're working on? Now a little quick, history on CPC. We've been in the business of making quick disconnect for about half a century now at this point, and we are headquartered in Minnesota, in The United States, and we've got a global presence. We've got teams all over the world, including APAC region, where we can be on the ground with you and meet you where you're at. We have a background in medical device quick disconnects as well as biopharmaceutical manufacturing. And what that means is that everything that we make, including these thermal management products, are made in a class eight clean room environment. Means we also adhere to some very strict quality standards. We have a enormous amount of investment and resources that go into our testing. We have a dedicated testing lab, a research lab, we have material scientists, everything that we need to do to make sure that these products do exactly what you need them to do. We are part of Dover Corporation, which is a Fortune 500 company. It's a great company to be a part of. We have great backing and great resources from them, as well as one of the other companies, that we'll hear about in a little while as well. Now to dig specifically into the thermal management portion of CPC, About ten years ago, maybe a little more by now, but liquid cooling in the high performance compute space was really starting to take off. And CPC was able to take, you know, at that point decades of experience and innovation in making dry break, non spill, non drip, quick disconnects and apply it to this emerging industry. Made, it was called our it's called our Everest product line, and that is dedicated purpose built for liquid coin of computer systems and electronics. The CPC as a company has more than 500 patents granted and pending just for quick disconnects. This this is what we do. This is our bread and butter. This is the core of our business. And as such, CPC has been able to take everything that we've learned and work to share that with the industry and the rest of the world. Our principal technologist has been leading the UQD version two work stream for OCP. And what that means is, like I said, we've been able to take our decades of knowledge, our experience and help use that to improve the rest of the community. CPC also is a a trusted true technical partner, not just another component supplier that's selling you a product. We are here to work with you, to collaborate with you, to figure out what it is exactly that you need and maybe even uncover other things that we didn't know were needed and come up with ultimately the best solution so that we can all move forward. At this point, we've all heard about the rise in these AI systems. It's a household term, everything from a chatbot on your smartphone to these humongous systems that are analyzing incredible amounts of data for research institutions and companies. With that, the compute power required for that has continued to go up. And we all remember and still experience in our our home computers, air cooled computing systems. Right? We've got fans in our computers to keep them cool. Well, not too long ago, as these high performance chips for these AI systems kept coming out more and more powerful, air cooling no longer did the trick. As we talked about about ten years ago, liquids cooling was really on the rise. It's really taken off in the last handful of years. As these chips and these systems are more and more powerful, they get hotter and hotter. It's no longer a question of if the cooling will happen. It's not even when liquid cooling will happen. It's here. Liquid cooling is here. It's established and we're now even looking forward into the future, the next five, ten, thirty years. What is coming and what is going to be required and how can we get ahead of it? Now because of that rising thermal output and the rising compute power, you all as thermal designers and thermal systems engineers really have your work cut out for you. The rise in this thermal output and the need for liquid cooling, not just liquid cooling, but precision in liquid cooling and incredible efficiency. Now to get more flow for more cooling, you have to work for it. You need more and more pressure drop. You know, you have a budget, pressure drop budget, so to speak, to work with. So every component in your system needs to be accounted for. It needs to be taken into consideration. Often people will come and say, what kind of flow does your quick disconnect have? What kind of pressure drop are we dealing with in your in your components? And really, as I'm sure a lot of you know, the answer is it depends. Right? It's not any one number. It's a relationship between the flow and the pressure drop. We like to deal with the flow coefficient, the CV. And we see the value here can be expressed by a pretty simple equation, but what it ultimately means is that the more flow you want through something, the higher the pressure drop you're going to have across that component. In other words, the more flow, the harder you have to work for it. Now as we talked about, the thermal output of these systems is getting higher and higher. We also have heard that these data centers are experiencing caps as to how much electricity they can consume. We also are dealing with space constraints. Nobody wants to build bigger and bigger. You want to do more with less. So these different constraints in different sides. How do we how do we deal with it? You know, if we have a limited amount of power, do we want to devote it to compute, which drives a revenue or to cooling, which doesn't, but it's still necessary? So how do we do that? How do we get more flow? How do we not work harder for it? And how do we stay within the same amount of space? Well, we have full flow connectors that are purpose built specifically for this to address all of these different barriers, these limitations that are coming at us, we need full flow. Now what you see here is a full flow in blade connector. It's designed specifically for these AI applications, these big data centers. And just to give you a bit of a gut check on what we're talking about improved performance, the inline version of what you see here has about a 90% less pressure drop compared to a valve connector of the same size. 90% less pressure drop. Now imagine for a second, what could you do if you had 90% less pressure drop to worry about in these areas of your cooling system? Think about what you could do with that extra pressure drop budget. This is this is how we optimize cooling efficiency. This is how we do it in a tight space with full flow connectors. I'm sure you have a few more questions on what that means and what that looks like and we'll we'll get into that in a little bit. Now as you're out there in the industry and you're evaluating different options, different systems, and different different solutions to your systems, what do you need to look for? So here are a few guidelines that are, sort of table stakes. You can think of that. You're going to need at a minimum for your in blade solutions. Do you have inline and elbow configurations? We're dealing with very tight spaces, very tight geometries. So we need to have the flexibility to be able to fit in all the different nooks and crannies within your system. With that, a swivel design is also increasingly important because it gives you that flexibility compared to, you know, like a hard plumbed solution. When it comes to material itself, three zero four stainless steel. That is becoming more and more just the standard across the board. What is being needed and with good reasons. It's a great material. It has very broad compatibility with other materials and other metals. It's corrosion resistant. It's tough. It's a very strong, sturdy material. And really it's it's what you need for these applications. And then also is it produced cleanly? How is it made? Where is it made? Nobody wants to deal with foreign material. FM has been the bane of so many data centers that we need to be incredibly sure that these parts are getting to your facility clean. That means they're being produced in a clean room setting. These these are a few. There are. There are more that we can get into if you'd like, but these are these are, like I said, the table stakes. These are the minimum requirements for an in blade full flow connector. Now I'm going to talk a little bit more about space for a second because it is such a constraint. There are the standards as far as how big racks are, how big server blades are, and everybody wants to stay within a 1u height tray. So that means low profile need is is very important. Now these connectors can there's a few different configurations that we can work with. One of them is they can be integrated directly into the cold plate. This further optimizes your space. You get even greater space utilization by not having to thread something in. Now now with all of these innovations, all of these advancements, all the technologies coming out and then the answers to those technologies, quality still reigns supreme. Quality is still the number one consideration that we need to make and think about when designing our systems. There are enormous amounts of investment going into these data centers, you know, into these chips, into these racks. It's a lot of money. You need to make sure that they are protected. You're dealing with liquid and electronics. You need to have safeguards in place to make sure that they're not mixing in the wrong way. We talked about clean room. The CPC thermal products are produced in a class eight or better clean room environment. The quality systems that we have in place. I mentioned our legacy, our history with medical device and biopharma. That means that all of our products, including these thermal management connectors, are made to very high ISO certified quality standards. Not just good manufacturing practice, but we are going above and beyond what is actually required for something like this because we know how critical it is. When it comes to testing, I mentioned before, we have so many resources going into testing. Not just performance and specification testing, but longevity, end of life. How reliable is it? How robust is it? How well can it handle variations in your operating parameters? We have a dedicated test lab just for this product group. We have a research lab that is looking into materials. We have materials scientists on staff that are dedicated to looking at these products and their components. We partner with customers who are experiencing, difficulties that we can utilize our material forensics lab to try to help discover root causes. All of this is to make sure that at the end of the day, the products that you get have been put through their paces and that you have complete confidence and complete trust in them that they are going to do what you expect them to do. And as far as being able to work with you, the people using these systems, we have actually a dedicated team of quality engineers that are out there in the field on-site working with the users, with the builders, with the maintainers. This provides an ongoing collaborative relationship so that we are able to support you in real time. Now this this phrase, we inspire confidence at every point of connection. I want to talk about this for a minute. When I first started at CPC, I read that and I thought, well, that's nice. That's a that's a nice phrase. You know, it's a little warm fuzzy feeling kind of a phrase that some sounds good on an advertisement. But the more I've worked here, the longer I've worked here and the more I've come to know the products, the the users, the industry itself, I've come to understand the broader meaning of this phrase. Yes. We want you to feel confidence when you're you're connecting these or when you're disconnecting them. We want we don't want you to worry about are they going to leak? Are they going to spill? That's a given. That's the product. But the deeper meaning is really this, what we're doing right now, the connection between the people. You know, as I work with customers and as I work with users of these technologies, that's the connection. That's the most important part is how are we connecting, and are you confident in the relationship and how we're able to support each other and how we are able to collaborate and work together and come up with solutions ultimately that are going to move the industry forward, are going to move your systems forward. That's the confidence. That's the connection that we're really talking about. Now one other connection I'd like to talk about here is one of our partner companies, another Dover corporation. We've been talking about inside the rack, and for a minute, I'm going to talk about outside of the rack, connecting the rack to the the pumps, the the cool the CDU. Now one of the other connections that I want to talk about is another Dover company and how they are influencing, you know, we've been talking about inside the rack, now I'm going to talk for a minute about outside the rack, connecting to the rack. Now I want to quickly just acknowledge that, Ben from our our sister company OPW had hoped to participate this but, wasn't able to. So I'm going to briefly mention their product. I'm not going to go too deeply into it. I'll save that for them because they're the experts. But this is the hyperflow and the hyperflow is how you are connecting to your entire rack system. Now if this is something you'd like to learn more about, please reach out. The OPW website is there. You can you can learn more there. Get in touch with me. I'll have my contact info in a couple of slides. We'd love to connect you with this company to talk about this product. But like I said, I want it I want it to be done justice, so I'm not going to talk too much about it right now. But we want you to know that it's there. So more on this connection portion. I want to really dig in here for a minute and hear some of the things that you all are asking. We've got a few questions collected here that I'll dig into. But right away first, you've got my direct email address right here. Please get in touch. Like I said, this is the best part of the job is getting to work with you, getting to dig into these questions, dig into the answers and work together. We've also got our website there. Please check that out. We have just a ton of resources. We have models and drawings available for you to download, white papers, specification sheets, lots of videos, even podcast episodes, and links to basically anything that you would need to get started and get going. So with that, let's dig into a few questions here. Alright. How is this different than a quick disconnect? Well for the full flow connector, I mean that is the difference. It's full flow. And in a quick disconnect you have valves built in so that when you disconnect it, it shuts off the flow. And that's how you don't get any spills, any drips, any leaks, anything like that. This doesn't have a valve so the benefit of that is that you don't have a valve to get in the way to impede the flow. It's full flow. See this kind of ties into the next question here. What are some situations when you would want a quick disconnect, and when would you want this fitting, the full flow? Okay. Well, think about it. When you have your rack and it's up and running and you want to, take out a single server blade, you want a hot spot for maintenance or troubleshooting, anything like that, that's when you're going to want to disconnect, a quick disconnect because you don't want to have to shut down your entire rack and drain all the coolant. You don't want downtime. So you want a quick disconnect. You can disconnect it, unplug it. You're going to stop flow to that blade. You take it out, you put the new one back in, you connect it and you keep going. That's when you would want a quick disconnect. Now inside is the this full flow and the what you can think about is now that that that blade has been pulled out, it's going to go to an engineering center, where it's going to be evaluated down to more of like the component level. At that point, it's going to get drained. So when you disconnect these full flow connectors, you don't have to worry about coolant spilling or leaking out. So there is no need for that valve in the first place. So just to recap, a quick disconnect is for the blade level. But once it's drained, you don't need those valves anymore. So you can use the full flow internally. Let's see. Next question. What is the approximate CV of this new product? Great question. So the CV for this for the for our inline version is, a little over three. Now what does that how does that compare? Because wait. What does that mean in context? Just to give a little bit of an idea, a valve connector of the same overall size, the same footprint, this is going to be about three times higher than that. So again, just think about that for a minute. Think about your system and thinking about the challenges that you're facing right now with with flow and pressure drop and temperature management. What would that mean if you had three times the CV in the same space constraint? Like that that's a significant advantage that you could have within your system. Alright. Next question. How is it disconnect? Yeah. Great question. We we're not calling it a quick disconnect because like I said, when because it's not valved, you don't want it to be able to be quickly disconnected when there is fluid, coolant running through it. So we wanted to put an extra safety step in there so that it's not going to be accidentally disconnected before it's ready to. So you can kind of see a little bit on this picture the there's a latch mechanism, but we have designed a custom tool to go along with it so that you need that tool to disconnect. Now again, that what that means is that you have that extra layer of security between the coolant and your electronics. This isn't going to be accidentally disconnected before it's before it's time. And then are there are there other applications besides data centers where this would be useful? Absolutely. Anywhere where anywhere really where you need full flow. Anywhere where flow is more important than a a valid connection. For for example here, edge edge computing is we're we're seeing a lot more demand in in that. And just in case you're not familiar, edge computing, if you think we're all familiar with the the big centralized data centers, you know, these large buildings with, you know, a ton of rack systems in there. But depending on the application and the use case, lag time is increasingly important, especially for critical applications like self driving networks or robotic surgeries where milliseconds are critical. So what we're seeing is these scaled down versions of these data centers being deployed closer to the use case. And you're seeing more of them spread out. So you're using the same type of hardware, the same type of cooling, so you would use the same type of full flow connector. I recognize that we're not going to get to all the questions here. Like I said, if you have other questions, if you would like to get more information, if anything I said here sparks any kind of discussion, please reach out. Like I said at the beginning, I think I've said it a couple of times now, this is the best part of the job. This is why we're doing this. This is why we're doing webinars. This is why we're we're out there talking about this is because we want to generate these conversations. We love talking about this kind of stuff, and we know you do too. So so let's connect. Please reach out. You can reach out directly to me. I'd love to touch base, dig in, answer any other questions. Visit our website. Check it out. There is a ton of great stuff there that I know will be helpful. And with that, we're going to wrap up here and I just want to say thank you again. We really appreciate you tuning in, listening, watching, and engaging. I mean, the the confidence at every point of connection. Right? This is this is why we're doing it is because we want to engage and drive these connections with you. So please reach out. Love to hear from you. Thank you very much. We have a long history in liquid cooling of electronics. We have really built the first purpose built products for this market. We started to early on realize that high performance computing was going to take off and that people were gonna follow what they did in supercomputing. And now with all the data center growth, that experience in supercomputing and high performance computing has really led us into this market for data centers and AI. We know how to make these products. This is not new to us. At CPC, quality is definitely at the core of what we do. So it's embedded deep within our culture. I'll say that that provides continuity and purpose from everyone along the NPD, new product development team, into operations and into into our sales channel. We all have the same mission to to provide the best possible solution for our customers, first and foremost. For our data center customers, quality means stability and reliability. Certainly on the front end, ensuring that your your product at time zero is gonna meet the requirements and not damage anything, but providing security and confidence that you can have your data center running with hands off operation for, three hundred sixty five days and thirty six thousand five hundred days. Right? Ten year reliability is really, really important and you can't have that without quality. Because we focus on liquid cooling, and we have developed this expertise over many years, decades even, We have learned what works and what does not work, and so we incorporate our learnings throughout the years to come up with a better product year by year. Our data center partners know that we do rigorous testing on our components. With the redundant seals in them, they can feel confident when they hear that famous click of the latch. They are assured that their valuable assets are protected. We wanna produce the best part out there. We understand some of our competitors are not building parts in a clean room. We are. That gives us a differentiator in in the marketplace. And if you really wanna have the best QD, you want it to have it produced in a clean room because it controls the amount of foreign material that could potentially impact the product performance. I think it's important to have that engineer to engineer relationship, and CPC's application engineers are are are ready to be able to engage with your team at whatever cadence or preference in terms of communication styles you want. So for me, what that means is that there's a there's an aspect of collaboration that's happening at the sameness level. And once we sort of have that collaboration channel locked in place, you can treat CPC's technical team essentially as an extension of your own technical team as well. CPC has almost fifty years of know how and expertise in quick disconnects. This is all we do. We've been in this industry since the beginning. Over ten years ago, we started hearing from customers the unique requirements of liquid cooling of electronics, and innovated a unique QD to fit that application. Since then, we've further entrenched ourselves, whether it be through industry groups or further product innovation, expansion of our portfolio, and of course, scale to produce it. We're part of the industry leading industry groups to make sure that standardization meets the quality expectations that our customers require in this market. The stakes are high for our customers. Right? Uptime, reliability of their systems is what enables their businesses to be successful. A quick disconnect is a really critical component in the overall system, so we want our customers not to have to think about the quick disconnect. Producing high quality, high reliability in our designs and our products is what gives them the confidence to focus on what they need to do to drive their business. Thanks, Dylan, for your presentation and for sharing about the solutions your team at CPC has been working on. Dylan have may have answered some of the questions you've had toward the end of his presentation. However, you if you still have a question for him, that you'd like him to answer, go ahead and type it into the q and a tab to the right of the chat or email him directly. Dylan's email address is listed in the chat. You can learn even more about CPC's liquid cooling quick disconnects and connectors on the CPC website, which we've linked to in the docs tab of the chat. I'm genuinely excited you're watching and learning with us today. You've joined us live from all around the globe, many locations across The US. I see several people who've joined us from India, Italy, Sweden, and The UK. Our next session, day one of data center cooling days, will start at 11:30 eastern, which is in fifteen minutes when we'll hear from Mark McDonald from Ventiva on IONIQ Cooling Solutions. Let's keep the momentum going. We'll see you soon.